Our BlogThe latest news and information about digital credentials
Innovating the form and function of academic credentials has never been a more important conversation for higher education.The credentials they historically confer include information that is becoming archaic to learners and employers.
Introduced in 2016, the Parchment Summit on Innovating Academic Credentials was designed to foster collaboration between higher education leaders, employers and others that believe in the potential of technology to extend the meaning of academic credentials. More than 200 practitioners gathered for the inaugural Summit, co-sponsored by Connecting Credentials, in February to launch the first in a series of discussions that will move the credential conversation forward.
Keynote presentations, panel discussions and workshops from the inaugural convening have been made available on the Parchment Summit website. Additionally, a variety of research and reports have been collected that represent the direction of the credential conversation.
Recently, Parchment Summit has launched its “After the Summit” series, including issue briefs and webinars, further extending the depth of many discussions that began at the 2016 Parchment Summit. Fresh, new content in the “After the Summit Series” includes:
- Issue Brief: “The Coming Transformation of the Credit and Degree System in American Higher Education: An Historical Perspective” by Dr. Arthur Levine, the sixth president of the Woodrow Wilson National Fellowship Foundation.
- Webinar: “History of Innovation in American Higher Education” Dr. Arthur Levine
- Issue Brief: “Credentials and Competencies: Demonstrating the Economic Value of Postsecondary Education” by Dr. Anthony Carnevale, Director, Georgetown University Center on Education and Workforce.
- COMING SOON: June 28 webinar with Dr. Anthony Carnevale to discuss his issue brief in more detail. Register for the free webinar today.
Interested in learning more about a specific idea tied to innovating credentials? Contact us and we will be happy to dig in.